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Home > Datasheet > ACS704ELC-005 Datasheet (Replaced by ACS712ELCLU)

ACS704ELC-005 Datasheet (Replaced by ACS712ELCLU)

Source: | Publishing Date:2007/07/02

Datasheet:ACS704ELC-005.pdf

Description

The Allegro ACS704 family of current sensors provides economical and precise solutions for current sensing in industrial, automotive, commercial, and communications systems. The device package allows for easy implementation by the customer. Typical applications include motor control, load detection and management, switched-mode power supplies, and overcurrent fault protection.

The device consists of a precision, low-offset linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy at the factory.

The output of the device has a positive slope (>VCC / 2) when an increasing current flows through the primary copper conduction path (from pins 1 and 2, to pins 3 and 4), which is the path used for current sensing. The internal resistance of this conductive path is typically 1.5 mΩ, providing low power loss. The thickness of the copper conductor allows survival of the device at up to 5x overcurrent conditions for the -005 and up to 3x for the -015. The terminals of the conductive path are electrically isolated from the sensor leads (pins 5 through 8). This allows the ACS704 family of sensors to be used in applications requiring electrical isolation without the use of opto-isolators or other costly isolation techniques.

The ACS704 is provided in a small, surface mount SOIC8 package. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the flip-chip uses high temperature Pb-based solder balls, currently exempt from RoHS. The device is fully calibrated prior to shipment from the factory.

 

Functional Block Diagram

Functional Block Diagram 

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