Multiple-chip device presents 6-mm2 footprint

Providing designers a solution for severely space-constrained applications such as small-form-factor desktops, media center PCs, ultra-dense servers, and graphics cards, the FDMF6700 is a fully optimized and integrated FET plus driver power stage in a 6 mm2 MLP package. The 25-A Pb-free device replaces three N-channel MOSFETs in a DPAK package and one driver IC in an SO8 package, saving up to 80% of the board space previously used.

In addition, through the integration of components into an optimized single-package solution, parasitic inductances of board traces and leads of the individual discrete packages are eliminated, improving overall efficiency.