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RambusInc. has signed a memorandum of understanding with Intel to explore possible future usesfor Rambus' family of XDR memorysolutions.

Rambus plans to dedicate certain technology and design resources to the effort and the evaluationwill be done on Intel?s siliconprocess technology. The company stressed that Intel was only evaluating the technology for possible future uses and has no specific product plans for the XDR memory technology at this time.

The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); FlexPhase circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for scalable point-to-point signaling on the data bus.