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Renesas Technology Unveils Ultracompact 2G/3G Dual-Mode RF Transceiver IC for Mobile Phones and 3G Communication Cards for PCs

发布时间:2008-02-19 浏览:3769次

Tokyo, February 7, 2008 −−Renesas Technology Corp. today announced the R2A60281LG, an ultra-compact 2G/3G dual-mode radio frequency (RF) transceiver IC that supports both 2G and 3G modes used in cellular communications. The device integrates in a single chip most of the high-frequency signal processing functions required by mobile phone handsets. Sample shipments will begin in March 2008 in Japan.

The RF transceiver IC performs functions such as converting received high-frequency wireless signals to a lower frequency for use by the baseband processor. It forms an essential part of the transceiver block of the mobile phone. The features of the R2A60281LG, summarized below, will facilitate the development of smaller and thinner handsets with support for global mobile telephony standards.

(1) Support for global mobile telephony standards through integration of 2G/3G dual mode functionality on a single chip
  The R2A60281LG integrates 2G (GPRS/EDGE) quad-band (850 MHz/900 MHz/1.8 GHz/1.9 GHz) and 3G (W-CDMA) quad-band (800 MHz/1.5 GHz/1.7 GHz/2 GHz) functionality into a single chip. It also supports HSDPA*1 categories 7 and 8 (maximum. 7.2 Mbps), allowing high-speed data downloads along with support for global standards.
(2) Approximately 20% smaller mounting area than previous RF transceiver ICs from Renesas Technology
  In addition to the features mentioned above, the R2A60281LG integrates a low-noise amplifier (LNA) and other functions. It combines all high-frequency signal processing functions other than antenna switching in a single chip in a thin and compact package (7 x 7 x 0.60 mm) that has a mounting area approximately 20% smaller than previous RF transceiver ICs from Renesas Technology.
(3) High-speed digital interface function supporting 3G
  The R2A60281LG implements A/D and D/A conversion functions formerly handled by an analog baseband processor. It includes a high-speed (maximum 312 Mbps) digital interface function that enables high-speed exchange of I/Q and control data with a digital baseband processor, making possible high-speed transfer of large data volumes. Since no analog baseband processor is necessary, the combined mounting area is reduced

< Product Background >

Recently in Japan more and more users of older mobile phone handsets are replacing them with global 3G models that also support the GSM (2G) standard used overseas, and there is an ongoing trend toward multi-band models that support more than one frequency band. In addition, multimedia handsets offering an array of non-phone functions, such as One-Seg terrestrial digital broadcasting reception, are becoming more popular, and this has resulted in an increase in the number of electronic devices mounted on handset circuit boards, even as the handsets themselves are becoming thinner. These trends have increased demand for RF transceiver ICs that support multiple frequency bands and both 2G and 3G modes while at the same time offering faster operation as well as smaller and thinner packages.

Renesas Technology already mass produces a 2G (GPRS/EDGE) quad-band (850 MHz/900 MHz/1.8 GHz/1.9 GHz) RF transceiver IC (5 x 5 x 1 mm) and 3G (W-CDMA) triple-band (800 MHz/1.7 GHz/2 GHz) RF transceiver IC (5 x 5 x 0.65 mm), both of which feature compact, thin packages and are used in a variety of handset products. Now, in response to the above-mentioned demand, the company has combined these two types of RF transceiver IC in a single chip. The R2A60281LG untracompact 2G/3G dual-mode RF transceiver additionally supports the 1.5 GHz band under the specifications newly standardized by the Third Generation Partnership Project (3GPP), an international body for establishing 3G mobile phone standards.

< Product Details >

In addition to a low-noise amplifier (LNA) and loop filter circuit,*2 the R2A60281LG incorporates a filter supporting CDMA2000 that attenuates wavelengths outside the desired frequency band in order to reduce susceptibility to radio interference. This makes it possible to complete system development on a high-frequency signal processing block in less time.

Future development plans include RF transceiver ICs with support for 3G-LTE*3 and 4G to enable even faster communication speeds.

Notes: 1. HSDPA:  High-Speed Downlink Packet Access. This high-speed packet communication standard is an extension of W-CDMA. It can be thought of as 3.5G relative to 3G. HSDPA supports downlink packet communication at speeds up to 14.4 Mbps. Category 8 supports a maximum data transfer rate of 7.2 Mbps.
2. Loop filter circuit:  The circuit that determines the frequency characteristics of the phase locked loop (PLL) circuit, which controls the oscillator. The input signal is compared to a signal generated internally by the circuit in order to detect shifts in frequency or phase. The detected error is fed back to the oscillator, and the output signal is generated. A loop filter circuit requires a high level of calibration accuracy.
3. 3G-LTE (Long-Term Evolution):  The terms "3G Long-Term Evolution" and "Super 3G" are both used. The system supports maximum communication speeds of 100 Mbps for downloads and 50 Mbps for uploads.

Product names, company names, or brands mentioned are the property of their respective owners.

< Typical Applications >

  • Mobile phones: 3G/2G mobile phone handsets, 3G communication cards, etc.

< Prices in Japan >*For Reference

Product Name
Package
Sample Price [Tax Included] (Yen)
R2A60281LG 120-pin LGA 1,050

< Specifications >

Item
Specifications
Product name R2A60281LG
Process 0.18m Bi-CMOS
Power supply voltage 2.8 V +0.1V/−0.1 V
Supported frequencies W-CDM: Band 1 (2 GHz), Band 5 (800 MHz), Band 9 (1.7 GHz), Band 11 (1.5 GHz)
GPRS/EDGE: 850 MHz, 900 MHz, 1.8 GHz (DCS), 1.9 GHz (PCS)
HSDPA 7.2 Mbps
Package 120-pin LGA (7 x 7 x 0.60 mm)

Information contained in this news release is current as of the date of the press announcement, but may be subject to change without prior notice.

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