Intersil Releases Samples of 10A, Highly Integrated Power Module Featuring PWM, Drivers, MOSFETs and Inductor in a Tiny QFN Package (ISL8201M)

ELECTRONICA, Munich, November 12, 2008 ¨C Intersil Corporation(NASDAQ Global Select: ISIL), a world leader in the design and manufacture of high-performance analog semiconductors, today announced the development of the ISL8201M, a highly integrated Power Conversion Module that saves space, reduces cost, and simplifies design.

The ISL8201M is a high efficiency, low noise, highly integrated DC/DC power solution in a thermally enhanced QFN package. Included in the package are the PWM controller, MOSFET drivers, power MOSFETs and inductor along with an optimized compensation circuit.

It simplifies power supply design as only input and output capacitors and a resistor is needed to implement a complete power solution. This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, wireless network systems, medical & instrumentation and distributed bus architecture based point of load applications. Also, an onboard input filter supports an ultra-low noise operation thus reducing EMI.

The ISL8201M achieves up to 93% efficiency and excellent thermal performance due to the QFN package that is designed to offer an optimum heat transfer through the PCB. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in³, roughly 4 times that of conventional open-frame modules thereby eliminating the need for heat sinks. Other features include internal soft-start, auto-recovery overcurrent protection, ENABLE pin option and pre-biased output start-up capability.

The high integration and performance of the ISL8201M is housed into a tiny 15mm x 15mm x 3.5mm QFN package

Pricing and Availability
The ISL8201M will soon be available for sampling in a 15-lead QFN package.