Compact High-Speed Logic IC Coupler: TLP118 and TLP2118

The TLP118 is an IC coupler in a compact SO6 package and is guaranteed to operate properly at temperatures up to 125¡ãC. Because the TLP118 is capable of high-speed data transmission at 20 Mbps, it is suitable for use in high-speed communication interfaces for factory automation (FA) devices or digital appliances such as plasma display panels (PDPs). The SO6 package has guaranteed minimum creepage and clearance distances of 5 mm, and the thickness of its internal insulation is guaranteed to be a minimum of 0.4 mm. Therefore, the SO6 package is in the reinforced insulation category according to overseas safety standards. The TLP2118 has two TLP118 circuits in an SO8 package and is capable of high-speed data transmission at 15 Mbps. The use of a single SO8 package can reduce the mounting area required by approximately 40%, compared to the use of two SO6 packages. For this reason, it is useful when reducing the size of a set requiring many channels or when reducing its cost.

Features:

• Inverter logic output (open collector output)
• High-speed data transmission: 20 Mbps (standard speed) with TLP118 and 15 Mbps (standard speed) with TLP2118
• Wide guaranteed operating temperature range: -40 to 125¡ãC for TLP118 and -40 to 100¡ãC for TLP2118
• When used in the SO6 package, TLP118 is compact but is still in the reinforced insulation category according to overseas safety standards.
• High instantaneous common-mode rejection voltage with excellent input-output noise-resistance: |CMH| and |CML| ¡Ý 15 kV/µs

Uses:

• Digital interfaces for FA devices
• PDPs
• Interface for measurement or control devices
• Office automation (OA) devices or digital appliances

Connection diagram:

TLP118

TLP2118

Example circuit :

A high-speed data transmission circuit in a digital interface