WINBOND

Winbond Electronic Corp. was founded in 1987 in the Hsinchu Science Park, Taiwan. The Company has been publicly traded on the Taiwan Stock Exchange (stock code£º2344) since 1995. Cultivated in the fields of product design, research and development in technologies, manufacturing and customer relationship over years, Winbond has attained a solid foundation and reputation in the semiconductor industry.

Winbond has two business groups - Logic IC Business Group and Memory IC Business Group. The Logic IC Business Group focuses on two specific sectors including ¦Ìc & ¦Ìc-based consumer products and computer logic products. The Memory IC Business Group is dedicated to technological development of Mobile RAM and Flash Memory, and its major products include Low Power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash etc. The integration and synergy of all product lines create a complete supply service network for customers.

Winbond currently operates a 300mm wafer fab, two 200mm wafer fabs^(£ª) and a 150mm wafer fab. The company has over 5,000 employees worldwide. Winbond values its customers and long-term partnership, therefore has subsidiaries in Mainland China, America, Japan and Israel to strengthen its regional customer support as well as global management. Through the collaboration of its experienced and intelligent engineering team, Winbond owns 2,500 patents worldwide and is continuing to strive for innovation and excellence. In the aspect of quality control, Winbond implements a solid manufacturing process control and quality control system to further improve the yield rate, supply chain management and customer satisfaction. The company has been accredited by IECQ, ISO 9001, ISO 14001 and QS 9000.

Winbond sets out ¡°Accountability, Innovation and Teamwork¡± as corporate values and implements the values to various operational activities to achieve its strategical objectives. Winbond also delivers technology for your work, your daily life and your entertainment to increase the productivity and joy of life.

£ªNote: Winbond officially announced the sale of 200mm fabs to Vanguard International Semiconductor Corporation (VIS) on March 22^nd, 2007. The property transfer time is scheduled to be on January 1^st, 2008.