Thermoelectric coolers support a ∆T of more than 60K to provide large thermal-control bandwidth

With a cold-side area of 0.98 mm2, the MPC-D303 Series microchip thermoelectric coolers (TEC) are one of the company¡¯s smallest and support a maximum ∆T of more than 60K, expanding the potential for laser and photonic sensor applications that require a large bandwidth of thermal control. Based on a scalable silicon MEMS platform technology, the new TECs are said to provide 10 times the cooling/heating power densities of standard thermoelectric coolers.

Cooling power is up to 100 W/cm2, and the TECs can realize temperature changes faster than 180K/s. The cooler¡¯s core is sputtered material that can be structured to exactly match the thermal and electrical requirements of many applications, reducing overall energy consumption and improve thermal management. Soldering temperature is 300C and the devices comply with RoHS initiatives. Maximum operating temperature of 200C.

Applications for the MPC-D303 coolers include laser and sensor temperature management, microscale thermal cycling, lab-on-a-chip, single-well to large-array PCR cycling, technical device characterization, and PCB embedded device cooling. (